[9727] in Zephyr_Comments
daemon@ATHENA.MIT.EDU (lucky f)
Sat Jun 18 06:31:21 2016
MIME-Version: 1.0
Date: Sat, 18 Jun 2016 16:01:19 +0530
Message-ID: <CANTRrTuUDL2q3uvmyr_etLQXnCe-ias5eMWFUANDBE0MqXAhVg@mail.gmail.com>
From: lucky f <sa19@cceeds.org>
To: sn1@pmme.co.in
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***Elsevier Materials Today Proceedings and Material Science Forum
publications. Conference dates: 29th to 30th July 2016 ****
PACE, Ongole, Andhrapradesh, India is going to organize International
Conferences PMME and ICMP with following publications: Papers are going to
be published in Elsevier: Materials Today Proceedings and Materials Science
Forum.
1. International Conference on Processing of Materials, Minerals and
Energy: PMME-2016
Publication: Elsevier: Materials Today Proceedings,
2. International Conference on Materials and Power: ICMP-2016
Publication: Materials Science Forum
Last date of Paper/Abstract submission has been extended to: 20th June 2016
*********
Please forward the information to your students/colleagues/friends.
*****************
For more details please go to:
*PMME: http://ow.ly/2RPe301oh6v <http://ow.ly/2RPe301oh6v> *
*ICMP:* http://ow.ly/eOfJ301oh7i
--
------------------------------
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Please notify the sender immediately by e-mail if you have received this
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information is strictly prohibited.
--001a1143e6e4cbfd4505358af864
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<div dir=3D"ltr"><p class=3D"MsoNormal">***Elsevier Materials Today Proceed=
ings and Material Science
Forum publications. Conference dates: 29<sup>th</sup> to 30<sup>th</sup> Ju=
ly
2016 ****</p>
<p class=3D"MsoNormal">PACE, Ongole, Andhrapradesh, India is going to organ=
ize
International Conferences PMME and ICMP with following publications: Papers=
are
going to be published in Elsevier: Materials Today Proceedings and Material=
s
Science Forum. </p>
<p class=3D""><span class=3D"">1.<span style=3D"font-stretch:normal;font-si=
ze:7pt;line-height:normal;font-family:"Times New Roman"">=C2=A0=
=C2=A0=C2=A0=C2=A0=C2=A0=C2=A0
</span></span><span style=3D"font-size:10.5pt;line-height:115%;color:black;=
background-image:initial;background-repeat:initial">International Conferenc=
e on Processing of
Materials, Minerals and Energy: PMME-2016<span class=3D""> </span></span><s=
pan class=3D""></span></p>
<p class=3D""><span class=3D""><span style=3D"font-size:10.5pt;line-height:=
115%;color:black;background-image:initial;background-repeat:initial">Public=
ation:
</span></span><span class=3D""><span style=3D"font-size:10.5pt;line-height:=
115%;color:red;background-image:initial;background-repeat:initial">Elsevier=
: Materials Today
Proceedings</span></span><span class=3D""><span style=3D"font-size:10.5pt;l=
ine-height:115%;color:black;background-image:initial;background-repeat:init=
ial">, </span></span></p>
<p class=3D"">2.<span style=3D"font-stretch:normal;font-size:7pt;line-heigh=
t:normal;font-family:"Times New Roman"">=C2=A0=C2=A0=C2=A0=C2=A0=
=C2=A0=C2=A0
</span><span style=3D"font-size:10.5pt;line-height:115%;color:black;backgro=
und-image:initial;background-repeat:initial">International Conference on Ma=
terials and Power:
ICMP-2016</span></p>
<p class=3D""><span class=3D""><span style=3D"font-size:10.5pt;line-height:=
115%;color:black;background-image:initial;background-repeat:initial">Public=
ation:
</span></span><span class=3D""><span style=3D"font-size:10.5pt;line-height:=
115%;color:red;background-image:initial;background-repeat:initial">Material=
s Science Forum</span></span><span class=3D""><span style=3D"font-size:10.5=
pt;line-height:115%;color:black;background-image:initial;background-repeat:=
initial"></span></span></p>
<p class=3D"">=C2=A0</p>
<p class=3D"" style=3D"margin-left:14.2pt">Last date of Paper/Abstract subm=
ission has been extended
to: 20<sup>th</sup> June 2016</p>
<p class=3D"MsoNormal">*********</p>
<p class=3D"" style=3D"margin-left:14.2pt">Please forward the information t=
o your
students/colleagues/friends. </p>
<p class=3D"MsoNormal">*****************</p>
<p class=3D"" style=3D"margin-left:14.2pt">For more details please go to:</=
p>
<p class=3D"" style=3D"margin-left:14.2pt"><b>PMME: <a href=3D"http://ow.ly=
/2RPe301oh6v">http://ow.ly/2RPe301oh6v</a> </b></p>
<p class=3D"" style=3D"margin-left:14.2pt"><b>ICMP:</b> <a href=3D"http://o=
w.ly/eOfJ301oh7i">http://ow.ly/eOfJ301oh7i</a> <b></b></p>
<p class=3D"" style=3D"margin-left:14.2pt"><b>=C2=A0</b></p>
<p class=3D"" style=3D"margin-left:14.2pt"><b>=C2=A0</b></p>
<p class=3D"" style=3D"margin-left:14.2pt"><b>=C2=A0</b></p>
<p class=3D"" style=3D"margin-left:14.2pt"><b>=C2=A0</b></p>
<p class=3D"" style=3D"margin-left:14.2pt"><b>=C2=A0</b></p></div>
<br>
<hr><b><span lang=3D"EN-IN" style=3D"font-size:12.0pt;line-height:115%;font=
-family:"Times New Roman","serif";color:#222222;backgro=
und:white">Disclaimer:<span> </span></span></b><span lang=3D"EN-IN" style=
=3D"font-size:12.0pt;line-height:115%;font-family:"Times New Roman&quo=
t;,"serif";color:#222222;background:white">This email and any fil=
e(s) transmitted with it are confidential and
intended solely for the use of the individual or entity to whom they are
addressed. This message contains confidential information and is intended o=
nly
for the individual named. If you are not the named addressee you should not
disseminate, distribute or copy this e-mail. Please notify the sender
immediately by e-mail if you have received this e-mail by mistake and delet=
e
this e-mail from your system. If you are not the intended recipient you are
notified that disclosing, copying, distributing or taking any action in
reliance on the contents of this information is strictly prohibited.</span>
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