[41209] in North American Network Operators' Group
Re: What is the limit? (was RE: multi-homing fixes)
daemon@ATHENA.MIT.EDU (Stephen Kowalchuk)
Fri Aug 31 11:30:40 2001
Message-ID: <3B8FAD73.EA9991CC@diamonex.com>
Date: Fri, 31 Aug 2001 11:29:55 -0400
From: Stephen Kowalchuk <skowalchuk@diamonex.com>
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What about using diamond to pull the heat away from these components instead of
water? Diamond is 4-5 times more thermally conductive than copper, can be put
into heat sinks in various configurations, and can give similar or better
results than water cooling when applied as a thermal transfer agent.
The trick to using diamond is managing the thermal junction between the diamond
and the additional material used to transfer the heat out of the box (because
obviously one can't create diamond fins). Diamond in itself is not a good heat
sink, but it is an excellent thermal transfer material. Point cooling can
easily be accomplished, and this has already a proven solution for laser diodes
and the like.
IIRC diamond is already being used in some Cisco products.
--
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Stephen Kowalchuk skowalchuk@diamonex.com
Diamonex, Incorporated
The wise therefore rule by emptying hearts and stuffing bellies,
by weakening ambitions and strengthening bones. -- Lao Tsu
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