[196281] in North American Network Operators' Group
Re: Temp at Level 3 data centers
daemon@ATHENA.MIT.EDU (Roy)
Sat Oct 14 13:48:02 2017
X-Original-To: nanog@nanog.org
To: nanog@nanog.org
From: Roy <r.engehausen@gmail.com>
Date: Fri, 13 Oct 2017 11:10:51 -0700
In-Reply-To: <20171013175149.GA3552@cmadams.net>
Errors-To: nanog-bounces@nanog.org
The IBM 308x and 309x series mainframes were water cooled. They did
have Thermal Conduction Modules which had a helium-filled metal cap,
which contains one piston per chip; the piston presses against the back
of each chip to provide a heat conduction path from the chip to the
cap. The cap was connected to the chilled water supply.
On 10/13/2017 10:51 AM, Chris Adams wrote:
> Once upon a time, bzs@theworld.com <bzs@theworld.com> said:
>> Also, the IBM 3090 at least, was cooled via helium-filled pipes kind
>> of like today's liquid cooled systems. It was full of plumbing. If you
>> opened it up some chips were right on copper junction boxes (maybe
>> they were just sensors but it looked cool.)
> Cray supercomputers had Freon lines through them for cooling, up until
> the last generation of the "old school" supercomputer. That was not
> sufficient to keep it cool, so they sealed the chassis (which was huge)
> and pumped it full of 4 tons of Fluorinert.
