[189109] in North American Network Operators' Group
RE: Patch panel solutions for 4x10GE breakout
daemon@ATHENA.MIT.EDU (Jameson, Daniel)
Thu May 5 11:17:37 2016
X-Original-To: nanog@nanog.org
From: "Jameson, Daniel" <Daniel.Jameson@tdstelecom.com>
To: Phil Bedard <bedard.phil@gmail.com>, "nanog@nanog.org" <nanog@nanog.org>
Date: Thu, 5 May 2016 15:17:31 +0000
In-Reply-To: <6CD354CF-6553-4F6C-82B7-BD951FD66B87@gmail.com>
Errors-To: nanog-bounces@nanog.org
Might be worth having a look at the Corning centrix modules. Very high den=
sities. 72 terminations per u. Front side mpo/mtp connections. Have some =
great slack storage and management options.
________________________________
From: NANOG on behalf of Phil Bedard
Sent: Thursday, May 05, 2016 9:28:55 AM
To: nanog@nanog.org
Subject: Patch panel solutions for 4x10GE breakout
So the newer equipment we are looking at uses QSFP+/MTP with 4x10GE breakou=
ts to deliver 10G. We are not wiring these up to things in the same rack, =
they will be going to patch panels and then elsewhere in a facility. It co=
uld potentially get messy with the panels we have today so we are looking a=
t other solutions. These are all SM LR connections using LC. There are a =
lot of SM MTP to LC options since that=92s the way most panels are wired, b=
ut they typically have 6 duplex LC connectors per MTP and not 4 which isn=
=92t very efficient in this use case. I=92ve seen others just use an inter=
mediate LC to LC panel and just wire the breakouts to those and then jumper=
the other side elsewhere.
Anything else others have used? The point of the solution is to keep the w=
iring mess in front of or near the device to a minimum.
Thanks,
Phil
