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From: "Robert D. Scott" <robert@ufl.edu> To: "'sjk'" <sjk@sleepycatz.com>, <nanog@nanog.org> In-Reply-To: <49FF483A.4040508@sleepycatz.com> Date: Mon, 4 May 2009 16:04:29 -0400 Errors-To: nanog-bounces+nanog.discuss=bloom-picayune.mit.edu@nanog.org You would get better density from a 110 patch than a 66, and telco frames for 19 and 23 are readily available. Robert D. Scott Robert@ufl.edu Senior Network Engineer 352-273-0113 Phone CNS - Network Services 352-392-2061 CNS Phone Tree University of Florida 352-392-9440 FAX Florida Lambda Rail 352-294-3571 FLR NOC Gainesville, FL 32611 321-663-0421 Cell -----Original Message----- From: sjk [mailto:sjk@sleepycatz.com] Sent: Monday, May 04, 2009 3:56 PM To: nanog@nanog.org Subject: DSX cross-connect solution I am trying to find hardware for a rebuild of our DS1 cross-connect frame and can't seem to find much out there. We've got ~300 DS1s that need to be x-connected between our M13s and I'm seeking an easy to manage solution. I've looked at the Telect panels but I'm concerned that my staff can't deal with wirewrap terminations. Has anyone seen, simply, a high density 66 field that can fit in a 23" rack? TIA -- steve
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