[59391] in Hotline Meeting
case 273659
daemon@ATHENA.MIT.EDU (bob sanderson)
Wed May 1 09:49:13 2002
Message-Id: <5.0.2.1.2.20020501095038.02a9fb40@hesiod>
Date: Wed, 01 May 2002 09:51:03 -0400
To: hotline@MIT.EDU
From: bob sanderson <bobsand@MIT.EDU>
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MIT CAMPUS AGREEMENT REPAIR FORM
________________________________________
date shipped : 5/1
UPS#
Case # 122794
Part Description: processor & mother board
Part Number : 501-5090 & 375-0090
Building and Room: 9-524
CPU S/N: FW82661433
Hostname: depot
Repair Information:
Symptoms : no post
Repaired By: lou
Date: 4/30
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<html>
<font face="Arial Black, Helvetica" size=3><br>
MIT CAMPUS AGREEMENT REPAIR FORM<br>
________________________________________<br>
<br>
<br>
<br>
date shipped
:
5/1<br>
<br>
UPS#<br>
<br>
Case
#
122794<br>
<br>
<br>
<br>
Part Description:
processor & mother board <br>
<br>
Part Number
:
501-5090 & 375-0090<br>
<br>
Building and Room: 9-524<br>
<br>
CPU
S/N:
FW82661433<br>
<br>
Hostname:
depot<br>
<br>
<br>
<br>
Repair Information:<br>
<br>
Symptoms
:
no post <br>
<br>
Repaired
By:
lou <br>
<br>
Date:
4/30<br>
<br>
<br>
************************************************************************
<br>
</font></html>
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